硅片电子制造教材.pptVIP

Chapter 2, Microfabrication (Electronics Manufacturing) Learning Objectives Be able to describe the basic processes of microfabrication Be able to explain the principles of photolithography. Be able to describe the basic mechanisms of the additive processes, including relative comparisons among them. Physical Vapor Deposition (evaporation, sputtering) Chemical Vapor Deposition Be able to describe the basic mechanisms of the subtractive processes, including relative comparisons among them. Wet Etching (isotropic, anisotropic) Dry Etching (physical, chemical, physical-chemical) Be able to describe the process of bonding and packaging Silicon Review In a perfect crystal, each of silicon’s four outer electrons form covalent bonds, resulting in poor electron mobility (i.e. insulating) Doping silicon with impurities alters electron mobility (i.e. semiconducting) Extra electron (“N-type”, with phosphorous, for example) Missing electron (“P-type”, with boron, for example) Silicon Circuits Silicon makes the transistors Transistors can be made to very large scale integration (VLSI) and ultralarge scale integration (ULSI) Silicon Micromachines The other application is micromachines, also called the microelectricmechanical system (MEMS), which have the potential of making the computer obsolete The micromachines include: Fuel cells DNA chips …… Microfabrication Silicon crystal structure is regular, well-understood, and to a large extent controllable. It is all about control: the size of a transistor is 1 ?m, the doping must therefore less than have of that How to control? Microfabrication Techniques Process of Microfabrication Crystal Growing Silicon occurs naturally in the forms of silicon dioxide and various silicates and hence, must be purified The process of purifying silicon: Heating to produce 95% ~ 98% pure polycrystalline silicon Using Czochralski (CZ) process to grow single crystal silicon Crystal Growing Wafer Slicing This step includes Slice the ingot into slices u