CEM-3覆铜板制作工艺路线（CEM - 3 copper plate production process line）.docVIP

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CEM-3覆铜板制作工艺路线（CEM - 3 copper plate production process line）.doc

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CEM-3覆铜板制作工艺路线（CEM - 3 copper plate production process line）

CEM-3覆铜板制作工艺路线（CEM - 3 copper plate production process line） CEM-3 copper clad laminate production process route 1.CEM-3 copper clad laminate for making raw materials (1) epoxy resin epoxy resin has excellent electrical properties, adhesion force, heat resistance and chemical resistance, in the NEMA standard and IPC standard CEM-3 is defined with epoxy resin as the main resin copper clad laminate, infrared spectrum.CEM-3 UL standard also showed that epoxy resin components. For CEM-3 epoxy resin, epoxy equivalent 185~500g/mol is more appropriate, the higher the epoxy equivalent, the greater the molecular weight, the smaller the crosslinking density after curing, the lower the plate Tg. The extensive use of.CEM-3 flame-retardant low brominated bisphenol A epoxy resin, epoxy equivalent 400~450g/mol, bromine content of 18%, at the same time, in order to improve the sheet resistance, moisture resistance, chemical resistance and dimensional stability, often add Nuofulake type epoxy resin amount or polyfunctional epoxy resin, in order to improve the cure the crosslinking density of bisphenol A type epoxy resin and epoxy resin or Nuofulake polyfunctional epoxy resin ratio is (60~90): (40~10) (PHR), the dosage is too high, will shorten the storage period, the adhesive sheet decreased peel strength and machinability. By adding the epoxy equivalent above 700~1200g/mol epoxy resin can increase the molecular bridge between the quantity, improve the plate bearing capacity of mechanical and thermal shock in the process, but it should be noticed that the epoxy equivalent resin is too high, too high molecular weight, high viscosity resin, will cause the glue impregnation of glass fiber cloth variation. (2) curing agent and accelerator CEM-3 commonly used dicyandiamide curing agent and phenolic resin curing agent (Novo Lark); commonly used imidazole compounds, such as 2-, 2- methylimidazolium ethyl -4- methyl imidazole, 2- phenyl imidazole, two benzyl methylamine can also be used as