B专业术语名词解释A50.pptVIP

19. LDI High Density Interconnection : 高密度互联 ----特点：直接用激光在干膜上曝光，不必用菲林 ，能保证完成线宽更细 。 18. HDI Laser Direct Image ---镭射直接曝光 ----特点：一般线宽/线间小于3mil/3mil 导通孔小于8mil, microvia 一般 要求用激光钻孔。 * 20. Heat sink: Side face Bottom Side Top Side PCB Pallet大铜块 Prepreg PCB+Prepreg+Pallet * Aspect ratio 21. Aspect Ratio： 纵横比（板厚孔径比）---影响电镀和喷锡 说明：一般采用板厚最大值与最小孔径之比。 d H D Aspect Ratio = d / H * 22. AGP: 显卡 主显示芯片 AGP * 23. Mother board: 内存插孔 PCI插槽 CPU插座 AGP插槽 主(机)板 Motherboard * 24. Memory bank: Memory bank 内存条 内存芯片组 * 第四篇： 检查与测试 * * * * 欧盟 RoHS WEEE指令对无铅PCB要求 无铅PCB必须满足欧盟 RoHS（Restriction of the use of certain Hazardous Substances in electrical and electronic equipment）2002/95/EC指令 和《电子信息产品生产污染防治管理办法》的规定，从2006年7月开始禁用六种物质 （铅、镉、六价铬、水银、PBB（多溴化联苯）、PBDE（多溴联苯醚）。其中PCB板主要检测项目包括：PCB基材、阻焊、丝印、铜皮等。 * If this specification conflicts with any other documents the following order of precedence shall apply: a)???????? Purchase order b)??????? Printed wiring board drawings and drill and trim documentation c)??????? This specification d)??????? Documents referred to in this speciation.? ? Supplier shall use applicable fabrication panel coupon as defined in IPC-2221.Micro-sections coupon ,and solder samples shall be provided with each shipment for validation requirement. * 1.???????? Maximum 3 repair operations are allowed on each board and the number of repaired PCB’S cannot exceed the 10 percent of the entire lot population.? ? 2.???????? Unless otherwise specified on the engineering drawing ,plated through via holes with a nominal size of 0.020inch or less may be partially or completely plugged with solder.? ? 3.???????? As a preventive precaution .before the laying down of the solder ,the PCB’S will have to be washed to remove the residuals due to the production process, the clearing degree of the PCB’S before the coating has to be the following one MAX 1 ug /square cm.. * 1.???????? Solder mask (SMOBC)-Apply LPI solder masks per IPC-S