乾膜光阻应用在高频覆晶凸块制程之研究.PDFVIP

乾膜光阻應用在高頻覆晶凸塊製程之研究 研究生 ： 柯志廷 指導教授 ： 張翼博士 國立交通大學材料科學與工程學研究所 摘 要 本論文研究的方向是將乾膜光阻應用於高頻覆晶封裝上。乾膜光阻比 起一般厚膜光阻有許多的優點，諸如：快速的製程時間、良好的表面均勻 性、低曝光能量與低廉的成本等。在本論文中，針對乾膜製程中每一道製 程，本論文皆提出最佳的製程參數，並使用多種不同材料的凸塊，以乾膜 光阻作為模具加以電鍍，並以推球應力測試探討不同材料凸塊的剪應力分 佈。 新的抗氧化層製作方法亦被提出 以解決銅凸塊容易氧化的問題。 此外，本論文並詳述覆晶封裝製程，分別討論以氧化鋁基版端與砷化 鎵晶片端製作凸塊的作法，以及覆晶結合的過程。 本實驗嘗試以不同尺寸 大小的共平面波導傳輸線，配合凸塊位置的分佈，研究其在高頻下的 S參 數表現。結果顯示，對於最佳化的覆晶結構而言，在 0～40GHZ的範圍內， S11 參數低於-20dB，而S21 參數高於-0.3dB。 -I- 總結來說，本文證實乾膜光阻適用於晶圓級高頻覆晶封裝製程。本實 驗顯示經過最佳化的傳輸線路設計與凸 塊分佈，低成本高效能的覆晶封裝 結構目標可以達成。 -II- The study of dry film photo-resist for high frequency flip chip bump application Student : Chih-Ting Ko Advisor : Dr. Edward Y. Chang Department of Materials science and Engineering National Chiao Tung University Abstract The purpose of this thesis is to apply dry film photo-resist for high frequency flip-chip packaging. Dry film photo-resist has advantages over other thick film photo-resist for high process speed, excellent thickness uniformity, low exposure energy, and low cost. In the thick film fabrication process, problems were found and resolved. For each process step, optimized process parameters were found. Several kinds of bump materials were electroplated with dry film photo-resist as plating mask. Shear force of bumps with different kinds of materials were investigated. Novel cladding metal fabrication process is also proposed to solve the oxidation problem of the copper bumps. In addition, detailed flip-chip process flow was described and implemented. Bumps growth on alumina substrate side and gallium arsenide chip side were processed and discussed