A Study on Package Stacking Process for ... - （研究包叠加过程）.pdf

A Study on Package Stacking Process for Package-on-Package (PoP) Akito Yoshida, Jun Taniguchi, *Katsumasa Murata, *Morihiro Kada, **Yusuke Yamamoto, ***Yoshinori Takagi, ***Takeru Notomi, ***Asako Fujita Amkor Technology Inc. 1900 South Price Road, Chandler, AZ 85248 *Sharp Corporation 2613-1, Ichinomoto-cho, Tenri, Nara 632-8567, Japan **Panasonic Factory Solutions Co., Ltd. 441-13 Nagahasu Tateishi-cho, Tosu, Saga 841-8585, Japan ***Senju Metal Industry Co., Ltd. 23 Senju-Hashido-Cho, Adachi-ku, Tokyo 120-8555, Japan E-mail : ayosh@, jtani@ , phone : 480-821-2408 ext. 5746, fax : 480-855-6345 *E-mail : murata.katsumasa@sharp.co.jp, kada.morihiko@sharp.co.jp, phone : +81-743-65-2779, fax : +81-743-65-4084 **E-mail : yamamoto.usuke@, phone : +81-942-84-5601, fax : +81-942-84-5620 ***E-mail : ytakagi@senju-m.co.jp, tnoutomi@senju-m.co.jp, afujita@senju-m.co.jp, phone : +81-3-3888-4019, fax : +81-3-5244-1763 Abstract Using the solder paste dipping process, the solder joint yield was much improved even when the bottom package was This paper outlines package stacking process guidelines for warped. Using this solder paste dipping process for the top a Package-on-Package (PoP) configuration. PoP stacks package, the same effect will be expected if the top