手机2008世界最新工艺指南(二)（Mobile phone 2008 world latest technology guide (two)）.docVIP

手机2008世界最新工艺指南(二)（Mobile phone 2008 world latest technology guide (two)） Mobile phone 2008 world latest technology guide (two) Speaker: China Mobile R D network added date: 2008-4-24 Thanks to the 1mp member Xiang Long son to share with you! Two 、 surface treatment and process of injection molding The mobile phone has become equipped with personal standards, its importance has been beyond the watches to carry personal items, so the development and application of new technology products is very fast, in order to meet the demands, global manufacturers are fully committed to the application and development of new technologies. In this feature, some surface treatment of mobile phone plastic shell will be introduced. The surface treatment of mobile phone plastic shell mainly includes electroplating, spraying, surface printing, IMD, IML and shell EMI spraying or evaporation. Electroplate 1.1 water plating The most common plating method is an electrochemical process, using positive and negative electrodes, the current is carried out in the plating bath, gold-plated, silver plating, nickel plating, chromium plating, cadmium plating, etc., electroplating liquid pollution is great. Water plating is also divided into two kinds of electroplating and chemical plating, electroplating is generally used as decorative surface, because of high brightness, chemical plating of the surface is gray, usually as anti-corrosion coating. Water plating process is mainly composed of two parts: pretreatment and electroplating. The function of pretreatment is to change the plastic material which is not conductive into conductive plastic material. Process pretreatment of water plating: plastic shell, and the whole surface degreasing linked (removal of surface oil), water washing, surface roughening, washing, recycling, washing, neutralization and removal of chromate reduction, water washing, surface sensitization of PD-SV sorption complexes, water washing, in addition to tin activation of PD, wa