Lead Free Solder Sn96 (SAC 305) 4900 DigiKey（无铅焊料Sn96 305 DigiKey(囊305)）.pdfVIP

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Lead Free Solder Sn96 (SAC 305) 4900 DigiKey（无铅焊料Sn96 305 DigiKey(囊305)）.pdf

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Lead Free Solder Sn96 (SAC 305) 4900 DigiKey（无铅焊料Sn96 305 DigiKey(囊305)）

Lead Free Solder SAC305 Page 1 of 2 Lead Free Solder Sn96 (SAC 305) 4900 96.3% tin, 0.7% copper and 3% silver M.G. Chemicals no clean Lead-Free Solder was designed with Sn/Ag/Cu (Tin/Silver/Copper) alloys as a lead-free alternative for the standard Tin and Lead solder. These alloys conform to the impurity requirements of J-Std-006 and RoHS. Use this solder anywhere you would use normal solder. If your products might enter Europe or California, you must ensure they are RoHS compliant. Products containing lead will not comply. To read more on this issue visit our RoHS Issue AppGuide Features / Benefits Lead free Complies with RoHS Exceeds the impurity requirements of J-Std-006 No Clean flux 21 Gauge, 0.032 diameters Excellent wettability Hard non-conductive residues 1 lb of lead free solder has 27% more length than leaded solder Flux Percentage M.G. Chemicals Lead Free Solder utilizes a state-of-the-art automatic wire extrusion and wire drawing machines to manufacture consistent solder. The introduction of flux core in the wire extrusion process involves constant monitoring of flux percentage to ensure minimal flux voids and irregular wire. Typical flux percentage for our Lead Free Solder is 2.0-4.0%. Flux Core A unique flux system was specifically used for high temperature lea