氮气对无铅回流焊温度的影响 impact of nitrogen on lead-free reflow temperature.pdfVIP

电子工艺技术 年 月 Electronics Process Technology 191 2010 7 氮气对无铅回流焊温度的影响 1 2 冯涛 ，王豫明 （1．林德公司，北京 100084； 2．清华大学SMT实验室，北京 100084） 摘 要：氮气属于惰性气体，在焊接中能够提高元件和印制板焊接面的润湿能力，减少氧化程度， 加快焊接反应速度。与空气环境中的焊接相比，在氮气环境中焊接，理论上能够降低所需的焊接温度， 并维持或提高焊点的质量和可靠性。首先对回流炉内氧气含量进行了标定，进而对氮气环境下焊接温度 曲线在焊料液相线上热容量值降低20%时的回流焊接进行了验证，依然达到甚至超过空气焊接下的焊点 质量及可靠性指标。 关键词：氮气氛围；无铅回流焊；焊点质量；可靠性 中图分类号：TN604 文献标识码：A 文章编号：1001-3474（2010）04-0191-06 Impact of Nitrogen on Lead-free Reflow Temperature 1 2 FENG Tao , WANG Yu-ming (1.Linde Group, Beijing 100084, China; 2. SMT Laboratory of Tsinghua University, Beijing 100084, China) Abstract: Nitrogen is an inert gas. The wetting abilities of the soldered surface of component and PCB can be improved in nitrogen atmosghere, at the same time, the oxidization can be reduced, and the soldering reaction can be speeded up. The soldering temperature can be dropped theoretically when the soldering is done in nitrogen atmosghere, and the quality and the reliability of the soldering joint can be kept or improved comparing with the soldering in air. First the oxygen content was set up in reflow oven. Then assumed that the heat capacity was dropped 20 percent above the liquidus temperature in nitrogen atmosghere, and did the reflow soldering, the experiment results showed that the quality and the reliability of the soldering joint are the same as and even higher than the soldering in air. Key words: Nitrogen atmosghere;