氮气回焊炉内氧浓度气氛对焊接的影响 effect of o2 concentration on solder joint in nitrogen reflow oven.pdfVIP

电子工艺技术 22 Electronics Process Technology 年 月 第 卷第 期 2013 1 34 1 氮气回焊炉内氧浓度气氛对焊接的影响 王会芬，吴金昌 （广达上海制造城表面贴装技术实验室，上海 201613） 摘　要： 目前厂内氮气炉的焊接气氛均是通过自带的氧浓度仪表进行控制。随着专业在线测试回流焊炉 内氧浓度设备的产生及应用，发现炉内实际情况与回流焊炉仪表的显示值相差悬殊。研究分别选择氧气体积分 -3 -3 -3 -3 -3 -3 数3×10 、7×10 、10×10 、15×10 、45×10 、80×10 以及空气进行回流焊接，对比焊点的外观、气泡 率、焊点强度以及界面IMC，最后发现不同氧气体积分数气氛对焊接品质无明显的影响。 关键词：氧浓度水平；焊点外观；气泡率；拉伸强度；界面化合物 中国分类号： 文献标识码： 文章编号： TN605　 Ａ　 1001-3474（2013）01-0022-04 Effect of O2 Concentration on Solder Joint in Nitrogen Reflow Oven WANG Hui-fen, WU Jin-chang (SMT Lab of Quanta Shanghai Manufacture City, Shanghai 201613, China) Abstract: Currently, each the reflow oven has one oxygen meter, so we control the oxygen concentration in the reflow oven depending on the displayed value. Accompanied by the generation and application of the professional online test equipment, we found that it is significant differences between the actual value and the reflow oven displayed by itself. We select seven -3 -3 -3 -3 -3 -3 oxygen concentration levels of 3×10 , 7×10 , 10×10 , 15×10 , 45×10 , 80×10 and air in this study. After contrasting with the appearance of the solder joints, the void rate, joint strength, and IMC, we found that there is no evident difference for O2 concentration varying. Key Words: Oxygen concentration level; Solder joint appearance; Void rate; Tensile strength; IMC Document Code: A Article ID: 1001-3474 (2013) 01-0022-04 几年前，伴随着有铅向无铅制程的导入，出现 的焊接可靠性并无明显差异，且焊接