Determining the Effects of Package Parasitics on （确定包寄生的影响）.pdfVIP

Determining the Effects of Package Parasitics on SI and EMC Performance Douglas C. Smith D. C. Smith Consultants P. O. Box 1457, Los Gatos, CA 95031 Tel: 408-356-4186, Fax: 408-358-3799, Email: doug@ Copyright © 2007 International Microelectronics and Packaging Society. Reprinted from the 2007 IMAPS Symposium Proceedings. This material is posted here with permission of the International Microelectronics and Packaging Society. Internal or personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution must be obtained from the International Microelectronics and Packaging Society. International Microelectronics and Packaging Society Web: 611 2nd Street, NE Washington, DC 20002 By choosing to view this document, you agree to all provisions of the copyright laws protecting it. Determining the Effects of Package Parasitics on SI and EMC Performance Douglas C. Smith D. C. Smith Consultants P. O. Box 1457, Los Gatos, CA 95031 Tel: 408-356-4186, Fax: 408-358-3799, Email: doug@ Abstract Signal Integrity and EMC problems are significantly affected by integrated circuit package parasitics. Such effects can be especially problematical for cases where devices undergo a die shrink in the same package. A simple method of determining the effects of package parasitics for a broad class