脉冲参数对电铸铜组织形态与硬度的影响.pdf

2008 6 30 6 ( 183 ) 1 : 1001-3849( 2008) 06-000 1-05 关丽雅, 　郑秀华, 　王富耻, 　李树奎, 　王翔宇, 　吕广庶 ( , 100081) : 采用脉冲电源, 酸性硫酸铜电铸液, 研 脉冲电流密度和占空比对电铸层组织形貌及硬度的 影响。结果表明, 在80%占空比条件下, 电流密度从3 / 2升高到5 / 2, 铸层晶粒细化、平均硬 A dm A dm 2 度升高; 而在电流密度为5 A/ dm 情况下, 占空比由50%提高到80%, 铸层晶粒细化。在电流密度5 2 A/ dm 、占空比80% 、频率200 Hz 条件下, 可获得约600 m 厚的细晶铸层, 晶粒直径小于 10 m。　　　　　　　　　 : 脉冲电铸铜; 电流密度; 占空比; 微观结构; 硬度 : T Q 153. 44: A Influence of Pulse Parameters on the Structure and Hardness of Electroforming Copper - , - , - , - , - , GUA N Li y ZHENG Xiu hu WA NG Fu chi LI Shu kui WANG Xi ng yu LV - Gu ng shu ( School of M teri ls Science nd Engineering , Beijing Institute of T echnoloyg , Beijing 100081, Chin ) Abstract: Electrofor ming experiments w ere c rried out by using pulsed pow er nd CuSO4 solution to ex mine the influence of current density nd duty cycle r tio on the microstructur e nd h r dness of electroformed l yer. T he r esults show th t t high duty cycle r tio of 80% the gr in 2 2 size reduces nd h rdness incre ses s current density incre ses from 3 A/ dm to 5 A / dm . At 2 high current density of 5 A/ dm the gr in size decre ses w ith the incr e se of duty cycle r tio from 50% to 80%. T he copper l yer w ith thickness of bout 600 m nd gr in structure of bout 10 m in di meter could be obt ined t optimized electroforming p r meters w ith current density of 5 / 2 , 80% 200 . A dm duty cy cle r tio of nd fr equency o