锡膏焊接(smt工序)（Solder paste (SMT process)）.docVIP

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锡膏焊接(smt工序)（Solder paste (SMT process)）.doc

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锡膏焊接(smt工序)（Solder paste (SMT process)）

锡膏焊接(smt工序)（Solder paste (SMT process)） Solder paste (SMT process) -------------------------------------------------------------------------------- Release date: 10:56 May 19, 2007 First, SMT process flow ? Single-sided assembly: Material inspection: silk screen paste (point, patch, glue), patch, drying (solidification), reflow, welding, cleaning, testing, repairing ? Double sided assembly; A: PCB A, incoming inspection screen printing solder paste (point adhesive), patch and drying (curing), A reflow soldering, cleaning, surface turning plate, PCB B screen printing paste (point adhesive), SMD - baking reflow soldering (only for B, the best surface cleaning, detection and repair) This process is applicable to the larger SMD, such as PLCC, on both sides of the PCB. B: PCB A, incoming inspection screen printing solder paste (point adhesive), patch and drying (curing), A reflow soldering, cleaning, surface turning plate, PCB B glue, patch, patch point B wave soldering, solidification, surface cleaning, inspection, repair) This process is suitable for reflow soldering on the A surface of PCB, B wave soldering. In the B assembled on the PCB surface of the SMD, this process should be adopted only when the SOT or SOIC (28) pin is below. ? Single mixing process Incoming inspection: PCB A surface, silk screen solder paste (point, patch, glue), patch, drying (solidification), reflow, welding, cleaning, plug-in, wave soldering, cleaning, testing, rework ? Double mixing process A: incoming inspection: PCB B point, paster, glue, patch, curing, turning board, turning board, PCB, A surface insert, wave soldering, cleaning, testing, repairing Paste first and then insert, apply to the SMD component more than the separation of components B: A, PCB plug-in incoming inspection (pin bending) - turning plate to a PCB B point patch glue, patch and curing - turning plate to wave soldering, cleaning, inspection and repair First insert and post, apply to separating components more than SMD c