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印制电路板制造技术(Printed circuit board manufacturing technology)
印制电路板制造技术(Printed circuit board manufacturing technology)
This article is contributed by wangwg77
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Introduction to printed circuit board process
Process name, process description, content description, Boards Circuit (Printed) is a key component in electronic assembly. It carries other electronic components and connects to the circuit to provide a secure working environment for the circuit. As to the circuit configuration of the case can be divided into three categories: [] the single panel will provide metal parts line connection is arranged on the insulating substrate material on the substrate and the printed circuit board is installed parts support. [] when one side of the double-sided circuit to provide electronic parts connection requirements, can be arranged on the circuit on both sides of the substrate, and the plate hole to connect the circuit board construction on both sides of the circuit. [in] multilayer application needs more complex, the circuit can be arranged into a multi-layered structure and pressed together and connected in each layer of circuit layer cloth hole circuit construction. The copper foil substrate is cut first and cut into size suitable for processing. The substrate film usually need to use the brush before grinding, micro etching methods such as surface roughening of copper foil as appropriate, then the temperature and pressure of the dry film photoresist attached on the seal. The paste dry film photoresist substrate into the ultraviolet exposure machine exposure, ultraviolet light resistance in negative transmission region will produce polymerization (dry film in the region in the later development, copper etching step is retained as the inner layer etching photoresist), and the bottom line on the image transfer to the surface dry film photoresist. Tear the protective film to film on the
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