镀覆孔的质量控制和检测方法（Quality control and inspection method of plated hole）.doc

镀覆孔的质量控制和检测方法（Quality control and inspection method of plated hole） When the solution work for a period of time (the length of time is determined by the load, the amount of solution) with a test board (with holes) with the product through the copper production line, in order to test the deposition rate meets the technology requirements. In accordance with the requirements of the process, the product board must also use the hole inspection mirror to check the product board, and then transfer to the next process. If the technical requirements are not met, the backlight test must be carried out for further testing and judgment. The specific methods for testing the deposition rate of copper and the backlight test are as follows: 1. determination of deposition rate: First off the copper substrate, cut to size is 100 * 100mm (1dm2) in the test board a row of holes, keep the backlight test. The deposition rate was measured by drying 1 hours before and after copper precipitation at 120, and weighing again. The rate of copper deposition can be calculated by the lower model: S = /t * 5.580 (W2W1) Formula: S copper deposition rate (m/min) W1 weight of pre test plate (g) W2 weight of test plate after copper precipitation (g) T copper precipitation time (min) 5.580 - 1 Cu per deposit, new copper layer thickness is increased (m) Detection of 2. backlight experiment: The density of copper deposits is mainly detected. The criteria for evaluation shall be based on the standards provided by the supplier. The German Shering company will sink copper layer density is divided into 12 grades back up to 5, and the lowest is 0.5 level; the other companys grading standards are different, there are assessment of eligibility criteria, such as the backlight level is below standard, the density copper layer, the electroplating it can not guarantee the quality of the final. The concrete method is to cut a piece of substrate material with holes into the sample, and then cut or grind it to the cent