BGA 封装工艺简介1的.ppt

Introduction of BGA Assembly ProcessBGA 封装工艺简介;BGA Package Structure;Typical Assembly Process Flow;FOL– Front of Line前段工艺;FOL– Front of Line Wafer;FOL– Back Grinding背面减薄;FOL– Wafer Saw晶圆切割;FOL– Back Grinding背面减薄;FOL– Wafer Saw晶圆切割;FOL– Optical Inspection;FOL– Die Attach 芯片粘接;FOL– Die Attach 芯片粘接;FOL– Die Attach 芯片粘接;Die Bond (Die Attach) 上 片;FOL– Epoxy Cure 银浆固化，检验;FOL– Wire Bonding 引线焊接;FOL– Wire Bonding 引线焊接;FOL– Wire Bonding 引线焊接;FOL– Wire Bonding 引线焊接;FOL– Wire Bonding 引线焊接;FOL– Wire Bonding 引线焊接;FOL–Optical Inspection 检查;;Material Problem;;;;;;With Weld; 2nd Bond Fail ( II ); Looping Fail(Wire Short I);Looping Fail(Wire Short II);Looping Fail(Wire Short III);EOL– End of Line后段工艺;EOL– Molding（注塑）;EOL– Molding（注塑）;EOL– Molding（注塑）;EOL– Molding（注塑）; EOL– Molding（注塑）;EOL– Post Mold Cure（模后固化）;EOL– Laser Mark（激光打字）;EOL– Ball Attach 植球;EOL– Ball Attach 植球;EOL– Ball Attach 植球;VACUUM;Ball REFLOW 参数;REFLOW PROFILE;EOL– Singulation;EOL– Singulation;EOL– Singulation ;EOL– Test 测试;EOL– Final Visual Inspection（终检）;EOL– Packing 包装;The End Thank You！