几种smt焊接缺陷(Several kinds of SMT welding defects).docVIP

几种smt焊接缺陷(Several kinds of SMT welding defects).doc

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几种smt焊接缺陷(Several kinds of SMT welding defects)

几种smt焊接缺陷(Several kinds of SMT welding defects) Several kinds of SMt welding defects Related search: SMt, welding defects [Abstract] this paper uses surface mount technology (SMT), solder printed circuit assembly in the production of vertical plate, bridging several welding defects phenomenon are analyzed, and the effective measures to solve the empirical summary for reference. SMT welding defects 1 Introduction The surface mount technology to reduce weight and increase the volume of electronic products to highlight the advantages of reliability, to meet the future strategic weapons intercontinental range, mobile launch, safe and reliable, advanced technology requirement of manufacturing technology. However, to formulate and select suitable for surface specific product assembly process is not a simple thing, because the SMT technology is the technology involves a number of complex systems engineering, the welding quality of one of these factors will affect the change of electronic products. The welding quality of components and joints is the key factor that directly affects the quality of printed circuit assembly (PWA) and even the whole machine. It is affected by many parameters, such as solder paste, substrate, solderability of components, screen printing, mounting accuracy and welding process, etc.. In the process of SMT research and production, we are well aware that the reasonable surface assembly technology plays an important role in controlling and improving the quality of SMT production. In this paper, several typical welding defects are analyzed, and corresponding technical methods are proposed to solve them. 2 several typical welding defects and Solutions 2.1 solder wave soldering and reflow soldering. The existence of solder joints shows that the process is not entirely correct, and the danger of short circuit of electronic products, therefore need to exclude. The international recognized standard is: existence of solder joints in printed circuit assembly

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