Femtosecond micro and nanomachining of （飞秒微和nanomachining）.pdf

Femtosecond micro- and nano-machining of materials for microfluidic applications Yelena V. White, Matthew Parrish, Xiaoxuan Li, Lloyd M. Davis, William Hofmeister Department University of Tennessee Space Institute, 411 B.H. Goethert Parkway, Tullahoma, TN, 37388, USA Abstract Ultrafast laser micromachining is a promising candidate for micro- and nano-fabrication technology. Due to the high precision of femtosecond ablation, laser-machined features can be added to devices prototyped by lithography. To accomplish that, parametric studies of laser interrogation of materials of interest are necessary. We present femtosecond laser ablation studies of glass, PDMS, fused silica, and diamond films. Samples were ablated by a 800 nm laser beam with pulse width of 200 fs laser and repetition rates of up to 250 kHz. Our results include single- and multi-pulse laser machining for fluidic and photonic devices. Feature size and structural dependences on ablation rates are discussed. Keyword list: Femtosecond machining; Microfluidic devices; Fused silica micromachining; Glass micromachining; PDMS micromachining; Diamond micromachining; Replication technique. 1. INTRODUCTION Femtosecond laser material processing is a promising technique for precise structuring of well-defined, micron- scale features, as there is little or no damage due to the generation of stress waves, thermal conduction, or melting.1,2 Femtosecond ablation conditions reduce fractionation of multi-component and multi-phase materials, which makes femtosecond technique useful for depth profiling, spectroscopy, and material structuring.3 A variety of materials, including met