DISCO设备说明书.docxVIP

划片机作业手册-----Disco Automatic Dicing Saw9890501 发表于: 2005-11-26 22:17 来源:?半导体技术天地(disco)1.0? ?? ???TitleDisco Automatic Dicing Saw2.0? ?? ???PurposeThe Disco Automatic Dicing Saw is a precision machine used to cut semiconductor wafers into individual chips or dice. Wafers are held to the chuck table by means of vacuum and the chuck can accommodate wafers with diameters from 2 to 6. The maximum table stroke (left-right movement of the chuck table) is 160 mm (6 5/16). The cutting range is 20.4 mm to 153 mm in 1 mm increments (0.8 to 6 in 0.025 increments). The cutting feed speed is variable from 0.3 to 10 mm/sec. (0.012 to 12/sec).The dicing wheel is mounted on a high frequency air-bearing spindle with an average rotation speed of 30,000 rpm. The range of depth left uncut is variable, and ranges from 0.005 mm to 19.995 mm (0.0002 to 0.7872) in steps of 0.005 mm (0.0002) increments. (Do not use a Z-index of less than 0.07 mm without consulting a superuser.)Following each cut, the Disco uses stored parameters to automatically index the wafer along the Y-axis. The maximum spindle stroke (forward-backward movement of spindle) is 160 mm (6 5/16), and the variable spindle index ranges from 0.002 mm to 99.998 mm (0.0001 to 4) in indexing steps of 0.002 mm (0.0001) increments.3.0? ?? ???ScopeThere are four fixed sawing modes available:MODE AThe cut is made only in one direction as the chuck moves from right to left (down cut).MODE BThe cut is made in both directions along the X-axis (down cut/up cut).MODE CThis mode also cuts in both directions along the X-axis, but the blade descends within the range of 0.005-19.995 mm along the Z-axis when the chuck table moves from left to right. Use this mode for cuts deeper than 650 microns.MODE DThis mode is constructed with a DRESS, which uses a dress board, and a PRE-CUT, which uses a dummy wafer.Dicing tape and hoops are available in the Microlab. Tape can be found on a dispenser in 432b, and hoops are stored beneath the disco saw. Dic