Soldering Methods and Procedures for ROHS （ROHS的焊接方法和程序）.pdf

123333333333333333333333 Soldering Methods and Procedures for Vicor ROHS Compliant Power Modules Overview This document is intended to provide guidance for solidification it will bond appropriately to both making high quality solder connections of RoHS components, producing a quality connection. Compliant Vicor Power Modules to printed circuit boards. This application note applies to lead free Figure 1 shows a side profile of a good solder joint soldering of Vicor’s RoHS compliant modules; for with a power module. Notice that the solder forms a non-RoHS compliant product, please see concave meniscus between pin and barrel. This is application note Soldering Methods and an example of a properly formed fillet and is Procedures for Vicor Power Modules Overview . The evidence of good wetting during the soldering following provides an outline for appropriate process. The joint between solder and pin as well as soldering procedures and the evaluation of solder solder and pad should always exhibit a feathered joints to insure an optimal connection to the power edge. In Figure 1 it can also be seen that the solder module. Common soldering defects will be covers a good deal of the surface area of both the examined and direction will be provided for pin and the pad. This is also evidence of good detecting and handling them. Vicor’s wetting. (Notice also that the solder joint is dull manufacturing facilities use the IPC-A-610 standards compared to leaded processing). This is evidence of for establishing quality solder joints. It is good immobilization of the joint during cooling as recommended that manufacturing processes using well as good cleaning of the