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Soldering, Brazing, Die and Wire Bonding to (焊接、钎焊、死亡和线结合)
Soldering, Brazing, Die and Wire Bonding to Electroless Nickel;
Conditions that Influence Reliability
By Don Baudrand
Consultant for MacDermid, Inc.
Waterbury CT
April 1995
847
,
Soldering, Brazing, Die and Wire Bonding
to Electroless Nickel;
Conditions that Influence Reliability
By Don Baudrand
htroducti on
Reliablejoining to electroless nickel deposits is critically important to the electronic
industry as well as in hardware fabrication. Because electronic devices oflen are
subjected to extreme temperature excursions during fabrication? electroless nickel
deposits may change physical characteristics in bulk and on the surface wherejoining
takes place.
High temperatures are common for multi-chip modules (MCM-C) and hybrid circuits on
ceramic substrates.
Nickel is a good electrical conductor compared with thick films used to metallize
ceramic substrates. Therefore, it is used to enhance conductivity as well as corrosion
resistance? diffusion barrier and the ability to be soldered, brazed, wire and die bonded.
The conditions for eachjoining method must be correct for the type of electroless nickel
deposit. Adjustments may be necessary to compensate for the environment to which the
deposit is exposed in he fabrication process.
Electroless nickel deposits have excellent unif
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