The Effects of Capillary Tip Geometry on Solder （毛细管尖端几何对焊接的影响）.pdfVIP

596 KKU Res J. 2011; 16(6) KKU Res J. 2011; 16(6): 596-611 http://resjournal.kku.ac.th The Effects of Capillary Tip Geometry on Solder Jetting Accuracy in Laser Solder Ball Jetting Process Sunchai Mata and Sirivit Taechajedcadarungsri* Department of Mechanical Engineering, Faculty of Engineering, Khon Kaen University * Correspondent author: sirtae@kku.ac.th, sir.tae@ Received February 3, 2011 Accepted June 23, 2011 Abstract The effects of capillary tip geometry on solder ball jetting accuracy in laser solder ball jetting process were studied in order to review the molten ball behavior. In the experiment, the micro-scale lead free solder ball was melted by laser energy inside three difference types of capillary categorized by tip geometry. A capillary type A was a conventional tip. Type B was manufactured by using micro-fabrication process to form the chamfer tip. And type C was micro-fabricated to have the fillet tip. The molten solder ball was jetted out from the capillary by pressure of inert gas onto substrate. The high-speed camera was used to capture the jetting behavior. The semi-auto visualization method was used to analyze solder droplet deposition on the substrate and compare between these capillary types. Then by using SEM, the quality of solder droplets on the substrate was compared. The results showed that the solder ball, jetted from different capillary types, was not melted completely when it started moving out from capillary tip. Its temperature kept increasing after it was eje