TSMC 28nm Technology in Volume Production（台积电28纳米技术在批量生产）.pdfVIP

TSMC 28nm Technology in Volume Production Hsinchu, Taiwan –October 24, 2011 –TSMC (TWSE: 2330, NYSE: TSM) today announced that its 28nm process is in volume production and production wafers have been shipped to customers. TSMC leads the foundry segment to achieve volume production at 28nm node. TSMC’s 28nm process offering includes 28nm High Performance (28HP), 28nm High Performance Low Power (28HPL), 28nm Low Power (28LP), and 28nm High Performance Mobile Computing (28HPM). Among these technology offerings, 28HP, 28HPL and 28LP are all in volume production and 28HPM will be ready for production by the end of this year. The production-version design collateral of 28HPM has been distributed to most mobile computing customers for their product-design use. The number of customer 28nm production tape outs has more than doubled as compared with that of 40nm. At 28nm, there are currently more than 80 customer product tape-outs. The TSMC 28nm process has surpassed the previous generation’s production ramps and product yield at the same point in time due to closer and earlier collaboration with customers. TSMC’s 28nm design ecosystem is available through its Open Innovation Platform® , with qualified EDA design tools and third-party IP ready for customer designs. “Building on TSMC and Altera’s 18 years of established technology partnership, TSMC’s comprehensive 28-nm process offerings and Altera’s leading-edge FPGA technology complement each other perfectly, enabling us to uniquely tailor our 28-nm product portfolio to best meet our customers’ diverse design requirements,” said Vince Hu, Vice President of Product and Corporate Marketing at Altera Corporation. “In our 28nm generation, TSMC’s 28LP process fits the requirement of Cyclone V and Arria V families with the lowest power and costs, and we have utilized the 28HP process for the industry’s first delivered high-end 28nm FPGA, Stratix V with the highest performance and the lowest power in