PCB印线路板术语中英对照简表.doc

本文由issac2005贡献 xls文档可能在WAP端浏览体验不佳。建议您优先选择TXT，或下载源文件到本机查看。 【印制线路板术语中英对照简表】 印制线路板术语中英对照简表】 排序 英语 Accelerate Aging Acceptance Quality Level (AQL) Acceptance Test Access Hole Annular Ring Artwork Artwork Master 简称 加速老化 A Back Light 背光法 B Base Material Base Material thickness Bland Via Blister Board thickness Bonding Layer C-Staged Resin Chamfer (drill) Characteristic Impendence C-Staged Resin Chamfer (drill) 基材 C Characteristic Impendence Circuit Circuit Card Circuitry Layer Circumferential Separation Creak Crease Date Code Delamination Delivered Panel(DP) Dent Design spacing of Conductive 裂痕 皱褶 周期代码 D Desmear Dewetting Dimensioned Hole Double-Side Printed Board 除污 缩锡 双面板 Drill body length E Eyelet Fiber Exposure Fiducial Mark Flair Flammability Rate 燃性等级 铆眼 纤维暴露 基准记号 Flame Resistant F Flare Flashover Flexible Printed Circuit,FPC Flexural Strength Flute Flux GAP Gerber Data，GerBerFile Grid G Ground Plane 耐燃性 扇形崩口 闪络 软板 抗挠强度 退屑槽 阻焊剂 格式档案 标准格 接地层 Grand Plane Clearance 接地层的空环 Haloing Hay wire 也称Jumper Wire. Heat Sink Plane Hipot Test即High Postential Test H Hook Hole breakout Hole location Hole pull Strength 白圈 散热层 高压测试 破孔 孔位 Hole Void Hot Air Leveling Hybrid Integrated Circuit Icicle I.C Socket Image Transfer Immersion Plating Impendent Impendent Control 破洞 热风整平 锡尖 图象转移 浸镀 阻抗 阻抗控制 Impendent Match I Inclusion Indexing Hole Inspection Overlay Insulation Resistance 阻抗匹配 底片 Intermatallic Compound(IMC) 介面合金共化物 Internal Stress Ionizable（Ionic） Contaimination IPC The Institute for Interconnecting and Packing Electronic Circuit JEDEC Joint Electronic Device Engineer Council J-Lead J Jumoer Wire Just-In-Time(JIT) Keying Slot K Kiss Pressure Kraft Paper Laminate Laminate Void Land Landless Hole 无环通孔 吻压 牛皮纸 基材 板材空洞 适时供应 离子性污染 Laser Direct Imaging LDI L Lay Back Lay Out Lay Up Layer to Layer Spacing Lead Margin Marking Mask M Mounting Hole Mul