作业中问题点与改善方法(Problems in operation and improvement methods).docVIP

作业中问题点与改善方法(Problems in operation and improvement methods).doc

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作业中问题点与改善方法(Problems in operation and improvement methods)

作业中问题点与改善方法(Problems in operation and improvement methods) Wave soldering operation problems and improvement methods of point 1. tin bad POOR WETTING: this situation is unacceptable defects in the solder joints only part of tin. Analyze the reason and improvement way is as follows: 1-1. external contaminants such as oil, grease, wax, such pollutants are usually available solvent cleaning, such oil is sometimes in the printing soldering flux from the 1-2.SILICON. OIL is usually used for lubrication and demoulding, usually found in the substrate and parts of the foot, while SILICON OIL is not easy to clean, because it used to very careful, especially when it is doing oil antioxidant often happens, because it will evaporate dip in the substrate caused by tin is poor. 1-3. often due to poor storage or substrate process problems on oxidation, and flux can not be removed will cause tin two times or bad, tin can solve this problem. 1-4. flux dip way is not correct, the cause for foaming pressure is not stable or insufficient, resulting in foam height instability or uneven and the substrate part does not stick to the flux. 1-5. tin time is insufficient or Sivin will result in insufficient tin, tin melting temperature and time because the need WETTING enough, usually the solder temperature should be higher than the melting temperature of 50 DEG to 80 DEG between tin, total time of about 3 seconds. 2. local tin DE WETTING: this bad situation with the tin side is similar, the difference is not a bad local tin foil, a layer of tin thin to form full of solder joints. 3. cold solder or disturred solder COLD SOLDER OR DISTURRED SOLDER JOINTS: solder joint seemingly fragmentation, uneven, most of the reason is the parts in the solder to solder joints formed when cooling caused by vibration, pay attention to whether there is abnormal vibration. Tin transportation 4. CRACKS IN SOLDER FILLET: solder joint cracking in this case is usually the solder, substrate, vias, and parts between

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