多次回焊处理对添加过渡金属元素Sn-Ag-CuBGA锡球接点-YOKE.PDFVIP

多次迴銲處理對添加過渡金屬元素Sn-Ag-Cu BGA錫球接點組織影響 The influence of multiple reflowing on the microstructure of the BGA joints with transition metal-containing Sn-Ag-Cu solders a* a b b 劉耀仁 、宋振銘 、賴逸少 、邱盈達 、 a b 國立東華大學 材料科學與工程學系，Advanced Semiconductor Engineering Group (Central Labs) Yau-ren Liu a*, Jenn-ming Song a, Yi-shao Lai b, Ying-da Chiu b a Department of Materials Science and Engineering, National Dong-Hwa University, Hualien 974, Taiwan b Advanced Semiconductor Engineering Group (Central Labs), Kaohsiung 811, Taiwan. 摘要 content of about 2.5at% was found at the interface 本研究針對Sn-Ag-Cu BGA錫球添加少量 Ni 、Co 、 of SAC-Co joints. Worthy of notice is that with Zn (簡稱 SAC-Ni, SAC-Co, SAC-Zn)對其與Cu/Ni-P/ the addition of Co the consumption of Ni-P Au 基板進行多重迴銲後觀察銲點組織變化影響。實驗 substrate was greater than the other samples and the 結果顯示 SAC及 SAC-Zn 接點介面主要生成簇晶狀 crystalline Ni3P layer adjacent to Ni-P substrate was (Cu , Ni ) Sn ，而SAC-Zn者有極微量之鋅 (約 discrete. 0.6 0.4 6 5 0.1wt%)固溶； SAC-Ni 接點介面於首次接合時生成則 Keyword: Lead-free solder, Sn-Ag-Cu, multiple (Cu , Ni ) Sn ，經多次迴銲後轉為層狀之(Ni , reflow. 0.6 0.4 6 5 0.84 Cu ) Sn ；SAC-Co 接點介面生成含2.5at%Co 之(Cu , 一、前言 0.16 3 4 0.6 Ni ) Sn ，形貌較連續圓鈍，特別的是其Ni-P 基材消 在電子封裝之銲錫材料中以錫鉛合金最廣為受 0.4 6 5 耗較明顯，Ni3P層則出現破碎情形。 用，因其穩定的機械性質、良好之銲錫性且已使用多