铜的表面处理专利技术(Patent technology for surface treatment of copper).docVIP

铜的表面处理专利技术(Patent technology for surface treatment of copper).doc

  1. 1、原创力文档(book118)网站文档一经付费(服务费),不意味着购买了该文档的版权,仅供个人/单位学习、研究之用,不得用于商业用途,未经授权,严禁复制、发行、汇编、翻译或者网络传播等,侵权必究。。
  2. 2、本站所有内容均由合作方或网友上传,本站不对文档的完整性、权威性及其观点立场正确性做任何保证或承诺!文档内容仅供研究参考,付费前请自行鉴别。如您付费,意味着您自己接受本站规则且自行承担风险,本站不退款、不进行额外附加服务;查看《如何避免下载的几个坑》。如果您已付费下载过本站文档,您可以点击 这里二次下载
  3. 3、如文档侵犯商业秘密、侵犯著作权、侵犯人身权等,请点击“版权申诉”(推荐),也可以打举报电话:400-050-0827(电话支持时间:9:00-18:30)。
  4. 4、该文档为VIP文档,如果想要下载,成为VIP会员后,下载免费。
  5. 5、成为VIP后,下载本文档将扣除1次下载权益。下载后,不支持退款、换文档。如有疑问请联系我们
  6. 6、成为VIP后,您将拥有八大权益,权益包括:VIP文档下载权益、阅读免打扰、文档格式转换、高级专利检索、专属身份标志、高级客服、多端互通、版权登记。
  7. 7、VIP文档为合作方或网友上传,每下载1次, 网站将根据用户上传文档的质量评分、类型等,对文档贡献者给予高额补贴、流量扶持。如果你也想贡献VIP文档。上传文档
查看更多
铜的表面处理专利技术(Patent technology for surface treatment of copper)

铜的表面处理专利技术(Patent technology for surface treatment of copper) Patent technology for surface treatment of copper 7 times I have read 2008-10-23 09:28 Patent technology for surface treatment of D0502 and copper * the price of this set of materials is 230 yuan. * this information contains national invention patents, utility models patents, scientific research results, technical literature, technical specifications, technical formulations, processes and so on. * this set basically collects and collects all the information in the country. It can be printed, edited and saved for electronic document and computer reading. * first remittance, payment to delivery, remittance bank see: home left column of the last column remittance way, click remittance mode. * call or send a text message or fax to tell you where you want the data, the bank and your address. * delivery mode. Make a disc by express courier, 2--3 days arrival; also through QQ or electronic mail transfer. (copper * surface) (copper surface treatment) 1. Technology of electroless copper nickel plating on semiconductor activated materials 2 、 room temperature copper pickling inhibitor 3, VLSI, multilayer copper wiring, chemical machinery, global planarization, polishing fluid 4. Chemical mechanical planarization polishing solution for copper and tantalum in multilayer copper wiring of VLSI 5 、 surface treatment method of conductive copper powder 6 、 surface treatment method of conductive copper powder 2 7 、 fast acid bright copper plating process for low carbon steel wire 8. Cleaning process of copper tube for refrigerator 9 、 brush plating, brush plating, lead tin copper grinding, wear-resistant layer plating solution 10, copper plating alloy and production method thereof 11 、 copper plating additive and preparation method thereof and application in copper plating of welding wire 12 、 non-metallic flow liquid copper plating method 13. Electroless copper plating process of hydrogen storage alloy powder in nonaqueou

您可能关注的文档

文档评论(0)

jgx3536 + 关注
实名认证
文档贡献者

该用户很懒,什么也没介绍

版权声明书
用户编号:6111134150000003

1亿VIP精品文档

相关文档