qfn封装元件组装工艺技术的研究（Research on assembly technology of QFN packaging components）.docVIP

qfn封装元件组装工艺技术的研究（Research on assembly technology of QFN packaging components） Research on assembly technology of QFN packaging components 1 Preface In recent years, the QFN package (QFN) because of its good electrical and thermal performance, small size, light weight, its application is growing rapidly, the QFN package called MLF micro lead frame package (MLF). QFN package and CSP (chip size package) is somewhat similar, but not the bottom element and PCB solder ball, the electrical and mechanical connection is through the PCB pad printing solder paste, after reflow formed to achieve, on the PCB pad design and surface mount technology put forward some new requirements. PCB design, welding inspection, repair etc. are the surface mount process should pay attention to, this paper will discuss the requirements and influence, make a detailed introduction to PCB pad design, screen design, inspection and repair. Features of 2 QFN package QFN is a non leaded package, square or rectangular, with a large exposed pad at the center of the package, used for thermal conduction, and a conductive pad for electrical bonding around the outer package of the large pad. Because the SOIC and TSOP package QFN package that is unlike the traditional gull wing lead, a conductive path between the internal pins and pads of short, self inductance and wiring package resistance is very low, so it can provide excellent electrical property. In addition, it provides excellent thermal performance through exposed leadframe pads, which have direct heat dissipation channels for releasing heat in the package. Usually the thermal pad is directly welded on the circuit board, and PCB in the heat radiation of pores contribute to the excess power spread to the copper ground floor, so as to absorb excess heat. Figure 1 shows this QFN package with an exposed thermal pad for PCB welding. Because of its small size, light weight, and outstanding electrical and thermal properties, this package is particularly suite