一种微型步进电机的微胶接装配方法的研究.pdfVIP

中国机械工程第 18 卷第 9 期 2007 年 5 月上半月 一种微型步进电机的微胶接装配方法的研究 1 2 1 马维民 　Hesselbach J 　郇 　极 1. 北京航空航天大学 ,北京 ,100083 2 . 布伦瑞克工业大学 ,布伦瑞克 ,德国,D38106 摘要 :采用微胶接技术装配微型步进电机的基体和导轨 。对胶粘剂的点胶特性进行实验 ,指出微电机 胶接装配中影响胶接质量的两个关键因素是胶滴体积的不稳定和胶滴的扩散 。为了解决该问题 ,在基体 胶接区表面通过蚀刻方法加工出凹槽结构 ,给出凹槽尺寸的确定原则和胶接实验的条件 。结果表明,凹槽 结构对胶滴体积具有“容错性”,可以在一定程度上克服胶滴体积的不稳定和胶滴的扩散对微胶接装配质 量的影响 ,但胶滴点胶的位置误差可能引起胶滴溢出凹槽 。 关键词 :微电机 ;微装配 ;微胶接 ;表面结构 ( ) 中图分类号 : TP242 　　　文章编号 :1004 —132X 2007 09 —1024 —04 Experimental Study on Assembling a Micro Step Motor Using Adhesive Bonding Technology Ma Weimin1 　Hesselbach J2 　Huan Ji1 1. Bei Hang Univer sity , Beijing , 100083 2 . Technical Univer sity of Braunschweig , Braunschweig , Germany ,D38106 Abstract : The adhesive bonding technology had been applied in t he assembly of a micro step motor . The adhesive ,disp ensing equip ment and t he assembly platform were introduced. The major p roblems in micro ad hesive bonding were analyzed , which were t he fluctuation of t he droplet ’s volumes and it s sp reading. A met hod taking advantage of t he surface structure on t he bonding area was tested. The basic p rinciples to de fine it s geometry and different p arameter s for experiment s were given . The result s show t hat , t he basic groove structure has the ability of fault - tolerance to t he volume of droplet ,and t hus can overcome the in fluence of t he mentioned factor s on t he quality of micro adhesive bonding. But t he po sition error of t he adhe sive droplet can result in it s sp reading out of t he groove. Key words : micro motor ; micro assembly ;