Metalreliability金属连线之可靠度Outline内容-崑山电子历程.PDF

2011/4/19 Metal reliability (金屬連線之可靠度) Electromigration (EM) 電遷移 electromigration 1 Outline(內容) •Introduction (簡介) •Al metal line development(鋁連線之演進) •Contact EM (接觸窗孔的電遷移) •EM mechanism and some key parameters (電遷移 的機制) •Dimensional and structural factors in EM (電遷移 的幾何尺寸效應) •EM physics and modelling (電遷移的物理與模型) •Metal EM Testing (電遷移的測試) •Other factors affecting EM (其他補充data) electromigration 2 1 2011/4/19 多層金屬連線薄膜製程 接觸窗 (via) 接觸孔 (contact) ••問問:: a)a)接觸窗孔做何用接觸窗孔做何用?,?, b)b)最大的接觸窗孔是最大的接觸窗孔是 electromigration 那個那個?,?, c)c)最好做與最難做的各是那一個最好做與最難做的各是那一個?? 3 IC內金屬連線之需求特質 •Low resistivity( 低電阻) •Resistance to electromigration •Easy process (製程容易) (void, hillock) (不易有電遷移) •Etchability(可蝕刻) •Resistance to corrosion(抗腐蝕) •Mechanical stable (good •Bondability (可黏上打線) adhesion, low stress)(機械性•Low contact resistance( 低接觸 佳) 電阻) •Smooth surface (表面平坦) •Step coverage (好的階梯覆蓋 •Clean process (low particle 性) density) (乾淨的製程) electromigration 4 2 2011/4/19 多層金屬連線製程之問題 •Aspect ratio are increasing(深寬比逐增) –Step coverage problem (階梯覆蓋性的問題) •EM and RC delay (電遷移和R