激光在晶体硅片监测和定位中的应用-韩森.pdfVIP

第六届中国太阳级硅及光伏发电研讨会 （6th CSPV) , 中国上海，2010.3.17 Sen Han, Ph.D., SPIE Fellow Suzhou HL Instruments, China 4D Technology , USA  Applications of silicon wafer  Processing and testing  Non-contact measuring methods  Laser techniques  Conventional interferometer  Dynamic interferometer  Laser micrometer  Conclusions Silicon wafer PV Application 太阳能 光伏发 电的应用 Microchip Silicon wafer Various Application  Silicon wafer processing  Material 硅片切割的  Silicon ingot 3个步骤： • 切料  Silicon wafer • 切方 ▪ Cutting procedure • 切片  Silicon wafer testing  Flatness形貌缺陷 ▪ 弯曲、凹凸、厚薄不均  Waviness表面损伤 ▪ 细微裂纹、线锯印记  Wafer alignment  Laser interference technique  Michelson  Mach-Zehnder  Fizeau  Twyman-Green  … …  Laser micrometer  Characteristics  Non-contact  Accurate  Fast Laser Linear CCD  3D data  Large field of view  Benefit  Advanced metrology enables greater profitability for silicon wafer manufacturers 现代计量技术能为晶体硅片厂商提供巨额利润 3 I (x,y) = I (x,y)(1+g(x,y)COS((x,y) +  ) n T n 4   3  2 I (x,y) = I (x,y)(1+g(x