Chapter SMT Introduction,SMT培训.pptVIP

Table of Contents/目录 Chapter 1 -- Introduction to SMT material and equipment 第一章 — SMT材料及设备简介 Chapter 2 – Stencil Printing Process 第二章 — 丝网印刷工艺 Chapter 3 -- Introduction to SMT Solder Paste 第三章 — SMT 锡膏简介 Chapter 4 -- Reflow Soldering Process 第四章 — 回流焊接工艺 Chapter 5 -- Introduction to SMT machine 第五章 — SMT机器介绍 Chapter 6 -- Stencil and its design guideline 第六章 — 钢网及其设计指南 SMT Processes and Manufacturing 表面贴装技术的工艺及制造 Chapter 1 – Introduction to SMT 第一章 – 表面贴装技术简介 SMT Equipment Overview/SMT设备纵览 What is SMT?/什么是表面贴装技术？ SMT stands for “Surface Mount Technology” SMT 表示“表面贴装技术” SMT is a process or assembly technique by which components are soldered onto the board surface. SMT 是把零件焊接到印刷线路板表面的工艺或装配技术 SMT vs THT/表面贴装技术 vs 通孔装配技术 THT stands for “Through Hole Technology” THT表示通孔技术 THT components has long leads and are insert mounted through the printed circuit board. The solder joints are formed using wave soldering technology 通空元件有长的元件脚，装配时将长脚插入并穿透印刷线路板，通过波峰焊接技术形成焊点 SMT components have no or short leads. They are mounted on the surface of the printed circuit board. The solder joints are formed using both wave soldering or reflow soldering technology 表面贴装元件没有或者只有很短的元件脚，元件被贴装到印刷线路板的表面，通过波峰焊接或者回流焊接技术形成焊点 SMT vs THT/表面贴装技术 vs 通孔装配技术 Composition of SMT/SMT 组成 SMT is comprised of/表面贴装技术组成 Material /原料 Components/元件 Printed Circuit Board/印刷线路板 Adhesives, Solder paste, Cleaning solvents/粘胶，锡膏，清洗容剂 Process 工艺 Glue dispensing/点胶 Printing/丝网印刷 Wave/Reflow soldering/波峰焊/回流焊 Inspection/Testing/检查/测试 Composition of SMT/SMT 组成 SMT is comprised of/表面贴装技术组成 Equipment /设备 Dispenser/点胶机 Printer/丝网印刷机 Placement/贴片机 Soldering/焊接设备 In-Circuit-Test/Functional Test/ICT在线测试设备/功能测试设备 SMT Process Flow Chart/SMT工艺流程图 SMT Advantages/SMT的优点 Why using SMT/为什么要使用SMT Increased Density/增加密度 SMC and SMD is only 1/3 ~ 1/10 in size compared THT components, as such the board real estate can be maximized and the weight of the assembled board is reduced. By using SMT, the assembled produc