以无电镀镍铜磷合金方法改善PTFE表面铜箔耐蚀性能之研究.PDF

以無電鍍鎳銅磷合金方法改善PTFE 表面銅箔耐蝕性能之研究 防蝕工程　第二十一卷第一期　第 69 ~ 74 頁　2007 年3 月 Journal of Chinese Corrosion Engineering, Vol. 21, No. 1, pp. 69 ~ 74 (2007) PTFE 鄭建麟* 、涂俊宇、吳貞欽、張家華、柏宏基 Study on the Improvement of the Corrosion Resistance of Copper Layer on PTFE by Electroless Deposition of Ni-Cu-P Alloy C. L. Cheng*, C. Y. Tu, J. C. Wu, C. H. Chang, H. J. Bor 為達聚四氟乙烯(PTFE)表面導電化，先以濕式化學法及錫鈀置換等敏化、活化步驟， 再以無電鍍技術在其表面沈積銅金屬。PTFE 具有良好的物性及電性，配合高導電度的銅層 已被廣泛使用在高頻的應用上。但因銅層易被氧化產生腐蝕，故本研究嘗試導入鎳磷合金 或鎳銅磷合金在 PTFE 表面以保護銅層，探討反應參數包括硫酸鎳及硫酸銅等反應物濃度 對合金沈積速度的影響，並進行各項物性及功能量測，包括附著力及電性測試，利用EDX 、 SEM 進行鍍層成份及表面型態分析，且藉由電化學方法量測鎳銅磷合金之極化曲線，以評 估其耐蝕能力。實驗結果顯示，鎳銅磷合金的沈積速度會隨硫酸鎳濃度提高而增加，但硫 酸銅濃度會抑制其反應速率。經由適當的操作條件，可在 PTFE 基材上得到鍍層結合力佳 且具有良好耐蝕性之鎳銅磷合金鍍層。 關鍵詞：聚四氟乙烯；無電鍍；表面改質；防蝕。 ABSTRACT For surface conduction on PTFE (polytetrafluoroethylene) substrate, the PTFE were sensitization through the activation of the palladium catalyst, followed by the electroless plating of copper. PTFE exhibits certain extraordinary characteristics including low dielectric constant, high thermal stability and good mechanical properties. As a result of high conductivity, the copper coated on PTFE is of great interest and value to printed circuit board (PCB), especially for high frequency applications. The combination of these properties makes the materials ideal for developing new printed wiring boards and integrated circuit packaging which require high frequency of working. One of the concerns in deposited copper is the co