PLASMA APPLICATIONS IN THE PRINTEDCIRCUIT INDUSTRY---印制线路板工业中的等离子应用.doc

PLASMA APPLICATIONS IN THE PRINTEDCIRCUIT INDUSTRY 印制线路板工业中的等离子应用 Published by March Plasma Systems INTRODUCTION What is Plasma? Plasma is partially ionized gases consisting of ions, electrons, free radicals and neutral species. This ionized gas mixture is conductive and highly reactive, which provides the basis for the plasma process. In circuit board applications the panels are suspended between electrodes. The chamber is evacuated (200 – 300 mTorr), process gas is introduced and the electrodes are energized with RF energy. This initiates the plasma. 引言： 什么是等离子 等离子体是指部分电离的气体，而气体是由离子、电子、自由基、中子。这种电离的混合气体是导电的，有很高反应性（活性），它为等离子制程提供基础。在线路板的应用中，板停放在电极之间。等离子反应仓被抽真空，反应气体被抽入其中，电极被射频电能激活。这就开始等离子处理 APPLICATIONS Etch Back/Desmear: (The removal of resin smear created from drilling.) Resin removal from inner layer posts after drilling is required to insure an electrical contact. Plasma processing removes epoxies, polyamides (flex or Rigid), high Tg blends and exotic material such as Bt’s and Cynite Estor. This process consists of three gases, O2, N2 and CF4. Three segments are required for sufficient removal of drill smear. The first segment with O2/N2 warms the panel to 80 – 95°C. This is to insure repeatable results from run to run and elevate the temperature of the material where it reacts best with plasma. Segment 2 uses CF4, O2, and N2. This is where the actual etching part of the process is completed. Temperatures are maintained during this segment to insure the required amount of material is removed. In segment 3, O2 is the only gas required. This segment removes any ash and fluorine that was left from segment one and two. The time in segment two is adjusted to meet desmear or etch back requirements. When etch back is required, a glass fiber removal after plasma is normally done prior to subsequent plating. 应用 凹蚀/除胶 （去除由钻孔产生的树脂胶渣）。去除钻孔后内层壁上的胶渣对于保证电气连接来说是必须的。等离子制程去除环氧树脂，聚酰亚胺，高TG以及特殊材料，例如Bt’s和Cynite Estor。这个制程由三种气体组成，分别是氧气，氮气，四氟化碳。充分去除胶渣有三个必须的步骤。第一步用氧气和氮气加热部件到80-95度。这是为