磁控溅射镀膜设备中靶的优化设计磁控溅射镀膜设备中靶的优化设计.pdfVIP

第4 期 16 VACUUM 2003 年7 月 磁控溅射镀膜设备中靶的优化设计 1 1 2 2 1 ,,, , (1.清华大学电子工程系, 北京　100084; 2.深圳豪 真空光电子股份有限公司, 广东　深圳　517057) : 磁控溅射已发展为工业镀膜生产中最主要的技术之一。对在镀膜批量生产中普遍存在的靶材利用 率、溅射速率和沉积速率低以及溅射过程不稳定等突出问题, 固然可用优化电源设计和调整工艺参数等加以 改善,但根本的问题在于整个系统, 特别是靶的优化设计。本文简要评述了已有靶的典型设计及其特点; 对靶 分析和设计的通行方法,包括电磁场有限元、等离子体粒子模型及流体模型、以及设计过程中其它一些需要注 意的问题作了讨论。鉴于国内目前在靶的分析设计方面与国际先进水平之间还存在着比较大的差距, 希望能 够引起有关方面的重视。 :; ; ; :TB43:A:1002-0322(2003)04-0016-07 Optimizing target design in magnetron sputter ing deposition of thin film 1 1 2 2 1 - , , , - , - LIU Xiang yu Z AO Lai XU Sheng FAN Chui zhen C A Liang zhen 　　　　(1. Department of Electronic Engineering , Tsinghua University, Beij ing 100084,China; 2. Shenzhen HIVAC Vacuum hoto-Electronic Co., Ltd. Shenzhen 517057,China) Abstr act:Magnetron sputtering has been developed as one of the most important technologies in industrial coating. During the process of thin film mass production, the prominent problems such as low utilization rate of target material, low sputter- ing rate, low deposition rate as well as the unstabitily of the sputtering process are ubiquitous. Although optimizing the pow- er designs and adjusting the process parameters could make improvement it is more important to optimize the design of the, whole system, especially of the target. The typical target designs and characteristics of the existed targets are reviewed briefly. The general target analyses and design methods are discussed systematically, including the finite-element method o electromagnetic field distributi