槽楔铜合金CuNiBeZrSi的热处理强化工艺及性能的研究英文版.docxVIP

2.2Study on structure and properties of solid solution of alloySelection of appropriate temperatures for copper alloy solid-solution treatment can eliminate early in the forging and casting process in the production of Crystal segregation and dendritic segregation, improve strength and toughness of the material. This article depending on your choice of copper alloy components of phase change interval, select the process parameters of the solution: temperature range of 890~970℃, selected a test every 20 ℃ temperature, insulation in furnace of the sample 1.5h, chilling in the water, and then measure its degree of hardness and conductivity, variation curve drawn. Figure 2 shows the solution temperature curve influence on Hardness(HB)hardness and conductivity of copper alloys.Figure 2 solution temperature on alloy of hardness and conductivity effectsAs for the copper alloysolid solution treatmenttemperature,appropriatefor thealloy afterheat insulationprecipitatescan be fullydissolved inaCu matrix,anddistribution,whilethe alloyafter solution treatmentwithfine grains,can ensure thefollow-upageingstrengthening effect.Under literature [3,4,5,6,7] known copper alloy of solid dissolved processing of process is in high of temperature Xia, makes solid solution in the of solute Atomic full dissolved to Alpha-Cu matrix in the, as temperature of rise, matrix solid solution in the solute Atomic dissolved more full, on conductive electronic of scattering role maximum cause conductive rate fell; hardness is first reduced then rise, main is due to as temperature of rise, solid dissolved degree increased,Precipitation phase dissolved into caused of solid dissolved strengthening and precipitation phase of reduced caused of softening each other offset and makes hardness changes not, and as temperature of rise, excess phase compounds constantly dissolved dissolved into, dissolved into volume has near limit, and at this time solute Atomic also in constantly dissolved into solid solution in