微纳系统及加工.docVIP

微纳系统及加工 外文文献综述 班级：机设七班 姓名：李文浩 学号：2012210511 日期：2015/12/28 Application of micro nano processing technology in the lithography process and the latest progress Abstract: in this paper, by comparing the UV exposure, electron beam lithography, ion beam lithography, scanning probe exposure processing, nano imprint lithography and other processes, and combining with the latest research progress, the reasons for the long-term UV exposure technology has become the mainstream technology. Keywords: lithography; exposure technique; application; difference between S1 introduction photolithography is precision, small and complex graphics processing technology on the film surface and metal, use it to manufacture parts: dividing scale, micro motor rotor, printed circuit board, porous metal screen and camera tube screen grid network etc.. Exposure technology is one of the most important basic technologies in the process of lithography. This paper mainly through the micro nano processing technology commonly used in the exposure of the comparative analysis, and combined with its latest research progress, analysis of UV exposure technology has become the mainstream technology for a long time. 2 UV exposure technology 2.1 UV exposure technology introduction UV exposure technology is a traditional optical exposure technology, there are two basic ways: Shadow exposure (printing shadow) and projection exposure (printing projection). In the shadow type exposure technique, the mask is directly exposed to the wafer, which is called the contact exposure. The mask and the wafer keep a gap to realize the exposure. Contact exposure technology is relatively simple, can obtain higher resolution (about 1 m), but the mask between the membrane and the chip easily clip into the dust particles, caused by mask permanent damage, reduce rate of finished products. Proximity exposure does not cause damage to the dust particles, but the gap between the mask and the wafer (typically 10~50 m) can lead