层厚度和晶界“阶梯型”缺陷对铜–镍复合薄 膜的力学性能的分子动力学模拟研究.pdfVIP

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层厚度和晶界“阶梯型”缺陷对铜–镍复合薄 膜的力学性能的分子动力学模拟研究.pdf

Applied Physics 应用物理, 2015, 5, 25-32 Published Online March 2015 in Hans. /journal/app /10.12677/app.2015.53004 The Effect of Layer Thickness and Interfacial Defect with Steps on Mechanical Properties of Cu/Ni Multilayers Thin Film Meng Yang, Jangang Xu, Yunguang Zhang School of Science, Xi’an University of Posts and Telecommunications, Xi’an Shaanxi Email: ymphysics@163.com, xjgo@ th th th Received: Mar. 14 , 2015; accepted: Mar. 25 , 2015; published: Mar. 30 , 2015

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