基于电-热-力耦合模型功率器件焊料层失效下 的热力特性分析.pdf

Smart Grid 智能电网, 2017, 7(6), 443-451 Published Online December 2017 in Hans. /journal/sg /10.12677/sg.2017.76049 Research about Thermal Fatigue Characteristic of IGBT Module in Considering of Electro-Thermal-Mechanism Coupling and Crack 1 1 2 3 3 Xiangyu Chen , Qingyu Li , Wenzhen Li , Fan Yang , Tingting He 1 State Liaoning Electric Power Co. Ltd., Panjin Power Supply Company, Panjin Liaoning 2 State Grid Inner Mongolia Eastern Electric Power Co. Ltd., Hohhot Inner Mongolia 3 State Key Laboratory of Power Transmission Equipment System Security and New Technology, School of Engineering, Chongqing University, Chongqing th th th Received: Oct. 28 , 2017; accepted: Nov. 9 , 2017; published: Nov. 15 , 2017 Abstract Solder defect is one of the main causes of failure in power module, and the thermal stress analysis is an effective way to improve its reliability. In the paper, an electro-thermal-mechanical coupling model is built, which considers the temperature dependent of material and mechanical characte- ristic based on measurement parameters, and the built model is verified by experimental results. In addition, the influence of solder crack on the damage accumulation, as well as the fatigue dam- age under power cycling and small thermal loading cases is investigated. Finally, the condition as- sessment model is proposed in considering of the effect of crack damage. Results show that the built model can well characterize the influence of the solder layer void and the solder layer shed- ding on the thermal characteristics of the device. When the voids in the solder appear, the tem-