金线工艺改铜线工艺.ppt

ASM Xu liang Object gold wire machine-upgrade to copper wire status Install copper wire part bond pad thickness status Capillary select Set up machine Production issue Install copper wire part Hardware install Gold wire machine upgrade to copper wire machine process and notice Hardware install filter copper kit nozzle flowmeter H2N2进气管 Hardware install Install copper wire bonding kit 安装的时候保证E-torch上表面和right nozzle 的下表面在同一个平面上．才能保证烧球的时候，氧化保护良好． Bond Pad Thickness status Capillary select Capillary select 0.8mil :UTS-28HD-CM-1/16-XL 20D HER 0.9mil :UTS-30HE-AZ-1/16-XL-E 20MTA 1.0mil :UTS-33HE-AZ-1/16-XL 20D 1.2mil :UTS-43JG-CM-1/16-XL 20D 1.5mil :UTS-48JF-C-1/16-XL 2.0mil :UTSDIC-58LJ-CM-1/16-XL 20D 3.0mil :UTS-90QN-CM-1/16-XL Set up machine Set up machine(改为铜线方式) F16(2009) 1090ABBB bond sequence [normal (gold wire)-copper F16 Tail control (减少tail too short 报警) F16 1090ABB40 Menu 1 12-16 Menu 9 20 Menu A 8 F15 bond process control(减少 NSOP NSOL) F15 (2002)10803 Menu 0 比gold wire 要 大一些 Menu 3 0 Menu 4 比bond force 稍小 Set up machine Search high (减少 NSOP tail too short) Gold wire : 8-12 copper wire : 10-15 EFO parameter Wire size (mil) 0.8 1.0 1.5 2.0 Current (mA) 5000-7000 12000-15000 time (us) 500-800 1200-1800 Set up machine BQM set up Wire size (mil) 0.8-1.2 1.5-2.0 Rise time 1-2 2-3 Power level low high Power control const-p const- p Speed set F15 比gold wire 稍低. 512-640 384-512 Set up machine Set up machine To Copper Wire 1 Higher EFO current for Cu 2 Shorter EFO time for Cu 3 In general, higher force power 4 Longer Time factor 5 Higher WC force due to Cu hardness 6 Less Contact Power, use force to deform the ball during the contact stage then apply more base power Production issue