SMT缺陷及防范措施.pptVIP

SMT defects and countermeasure SMT缺陷及防范措施 Identify SMT defects Major contributor to defects缺陷的主要分布 Learning Objectives 学习目的 Component damaged (Nicks, cracks, or stress fractures)/ 元件损坏 Nicks, cracks, or stress fractures. 缺口，裂纹，压痕 Component damaged (Nicks, cracks, or stress fractures)/ 元件损坏 Countermeasure/对策 1. Raw material damaged: purge the batch material./来料损坏: 清除这批来料. 2. Damaged during SMT process (Fixture or machine touch it) : Investigate and take corrective actions for nonstandard operation. 在SMT流程中损坏(夹具和设备接触): 调查分析并且对不规范的操作作出矫正行动. 3. Fast cooling rate on reflow process : Control the cooling rate to below 4degree per second. 在回流过程中冷却速率过快: 控制冷却速度使斜率保持在每秒4度以下. Typical reflow profile/ 回流曲线典例: Misalignment 偏位 Component lead lifted 元件引脚翘高 Component lead lifted 元件引脚翘高 Solder ball 锡珠 Solder ball 锡珠 Non-Wetting, Dewetting/ 虚焊，半润湿 Non-Wetting, Dewetting/ 虚焊，半润湿 Cold solder/ 冷焊 Cold solder/ 冷焊 Cold solder/ 冷焊 Solder hole/锡洞 Solder hole/锡洞 Disturbed Solder/焊锡紊乱 Disturbed Solder/焊锡紊乱 Solder Projections/锡尖 Solder Projections/锡尖 No Solder/ 无锡 No Solder/ 无锡 Insufficient Solder/少锡 Insufficient Solder/少锡 Excess Solder/多锡 Excess Solder/多锡 Wrong Orientation/Polarity 反向, 极性反 Wrong Orientation/Polarity 反向, 极性反 Solder projection violates assembly maximum height requirements or lead protrusion requirements. 焊锡毛刺违反组装的最大高度要求或引脚凸出要求. Solder projection violates minimum electrical clearance. 焊锡毛刺违反最小电气间隙. Countermeasure 1. Less flux on board : Increase the flux spray rate on board before go through wave soldering (wave solder). 助焊剂不足: 增加助焊剂的喷射量 2. Low conveyor ramp: Raise the conveyor ramp per actual status (wave solder). 传送带角度过小: 根据实际情况校正传送带角度 3. Excess preheat temperature and time (flux dry off): Optimize wave soldering profile. (Wave solder) 预热过度（助焊剂过度挥发）: 优化波峰曲线 (波峰焊) 4. Caused by rework: Standardize operator handling and enhance visual inspection. 返修中产生: 规范员工操作加强目检. No solder to the land or termination where solder is require