Controlled Surface Etching Process for Fine Line（译文）.doc

Controlled Surface Etching Process for Fine Line/Space Circuits 精细线宽/间距线路的表面蚀刻过程控制 Ken-ichi Shimizu, Katsuji Komatsu, Yasuo Tanaka, and Morio Gaku Introduction 序言 Semiconductor chip design is moving towards increasingly finer lines to meet the demands of more functions and higher speed. 半导体芯片设计正在移向更加精细的线宽以满足更多功能和更高速度的需求。 This trend has placed increasing demand on high density PWBs and substrates for plastic packages to develop many new materials and processes. 这一发展趋势为？高密度印制线路板和基板上提出了越来越高的需求，促进很多新的材料和制程的发展。 To achieve such requirements, some of the key points of substrate design rules are the line/space and the land diameter of PTH (Plated Through Hole) or BVH (Blind Via hole). 为满足这种需求，一些关键的基板设计标准是线宽/间距、PTH(镀通孔)深孔或微盲孔的焊盘直径。 Regarding the land diameter, there has been much effort to decrease hole diameters, and the process has changed from mechanical to laser drilling which became standard in the industry for the processing of smaller holes, such as around 80 microns. 关于焊盘直径，必须尽量减小孔直径，制程由机械钻孔转向激光钻孔，激光钻孔已经成为小孔制造工业的标准，比如约80微米。 On the other hand, many studies have been done simultaneously to develop smaller line/space. 另一方面，同时也对更小的线宽/间距的发展作了很多的研究。 However, the demands for finer line/space are getting stronger and will be even more in the future. 不管怎样，精细线路/间距的需求变得更强烈，未来会更加多。 Therefore, the first target of this report was to find out what is the minimum line/space that can be achieved with the subtractive method, because that has been used as the main process in copper line forming in multilayer PWBs since their introduction to the market in the1960s. 因此，本报告的第一目标是找到“减成方法”可以完成的最小的线宽/间距，因为它是业界自二十世纪六十年代引入的多层印制线路板最主要的铜层线路形成的重要方法。 Next, another option: the pattern plating process was studied to achieve finer line/space. 接着，另一个选择：研究“图形电镀制程”以实现精细线路/间距。 In the 1960s, many kinds of the pattern plating processes such as the pattern plating process, the additive process, and the semi-additive process had already been developed in addition to the panel plating process like the su