锡炉基本焊接技术.ppt

錫爐基本焊接技術 Wave Soldering Overview 錫爐與波峰 Oven Solder Wave 錫爐與波峰 /Oven Solder Wave 塗上助焊劑 /Flux Application 塗上助焊劑 /Flux Application 發泡器 /Foam creator 塗上助焊劑 /Flux Application 助焊劑的控制 /Maintenance of Flux  補充溶劑或添加新鮮助焊劑 /solvent replenishment and adding fresh flux 補充溶劑或添加新鮮助焊劑 /solvent replenishment and fresh flux adding 稀釋液 (Thinner) 有關助焊劑之安全使用 /Safety in flux using 因助焊劑是含有酒精，固使用時應避免煙火。 Because there is some alcohol in the flux,firs is not allowed at the working place. 助焊劑乃是化學品，在使用時要小心。 Carefulness should be taken when handling flux chemicals. 助焊劑應存放在陰涼的廠庫裏，在生產環境不宜多存。 It should be stored in the cool warehouse, do not put too much at the working place 助焊劑的類型 /Type of flux 有機溶液清洗型 /Organic soluble flux ：Alpha 809 Flux 活性強，高固含量，高焊接效能 High activity, high solid content very good soldering performance 殘留物腐蝕性強。 Corrosive residue 清洗可用1,1,1 - 三氯甲烷。 Can be cleaned with chloroform 水清洗型 /Water soluble：Alpha 859 Flux 和上種助焊劑相近，但殘留物可用水清洗。 Similar to the organic soluble flux, but the residue can be cleaned with water 助焊劑的類型 /Type of Flux 免清洗型 /No-clean Flux：Alpha RF800, FLS0017H, LS388 低固含量，活性較弱。 Low solid content activity 殘留物少，對元件，基板金屬沒有腐蝕性。 Little residue, will not attack/ corrode the component PCB 環保型 /Environment Protective Flux：Alpha NR330 系列, NR310B 水劑助焊料，沒有揮發性大的化合物。 Water-based, VOC-free or low VOC 低固含量，殘留物極小，沒有腐蝕性。 Low solid content, little residue free of corrosion 免清洗型助劑。 No –clean flux 助焊劑 /Flux 助焊劑 /Flux 預熱 /Pre-heat 預熱 /Pre-heat 預熱 /Pre-heat 熱風對流型 /Hot Air Convection Pre-heat 熱風對流型預熱 /Hot Air Convection Pre-heat 極有效的導熱方法 Effective thermal conduction model 減低 PCB 跟空氣的 ?T Decrease the ?T between PCB hot air 減低板面點跟點的 ?T Ensure the uniformity of the temperature on bd surface 提供足夠熱力揮發水份 (VOC-Free Flux) Enough energy to volatilize the water in flux (VOC-Free Flux) 輻射式預熱 /IR Radiant Pre-heat 選擇性熱傳 Selective heating 板面的 ? T 較大 Significant ? T on bd surface VOC free 焊劑的預熱要求不能達到 Can not be applied to the VOC free flux 輻射式預熱 /IR Radiant Pre-heat 量度方法 /