电路板中无铅焊点失效分析研究现状-学士学位论文外文翻译文献.doc

题 目: 电路板中无铅焊点失效分析研究现状 学 生 姓名：郑某某 指 导 教师：王某某 系（院）别：某某系 专业、班级：某某学专业1002班 填 表 时间：二○一四年三月 xx科技师范学院某某系 制 Effect of thermal aging on the interfacial structure of SnAgCu solder joints on Cu Weiqun Peng a, Eduardo Monlevade b, Marco E. Marques b Abstract Interfacial structure plays a great role in solder joint reliability. In solder joints on Cu, not only is Kirkendall voiding at the solder/Cuinterface a concern, but also the growth of interfacial Cu–Sn intermetallic compounds (IMCs). In this work, evolution of microstructure in the interfacial region was studied after thermal aging at 100–150 _C for up to 1000 h. Special effort was made during sample preparationto reveal details of the interfacial structure. Thickness of the interfacial phases was digitally measured and the activation energywas deduced for the growth of Cu3Sn. Kirkendall voids formed at the Cu/Cu3Sn interface as well as within the Cu3Sn layer. The thicknessof Cu3Sn significantly increased with aging time, but that of Cu6Sn5 changed a little. The interfacial Cu3Sn layer was found growingat the expense of Cu6Sn5. Evolution of the interfacial structure during thermal aging is discussed. 2007 Published by Elsevier Ltd. 1. Introduction With the trend of miniaturization of electronic devices,the electronic industry is facing many new challenges. Solderjoint reliability is one of them. Electroless Ni withimmersion Au plating (ENIG) has been widely used for long time as coating on soldering pads, where the Ni plating functions as a diffusion barrier between solder and Cu pad. However, in fine pitch ball grid array (BGA) packages,the ENIG system has encountered a serious reliability problem, i.e. black pad [1,2]. Extensive investigation have been conducted to find out the failure mechanism of black pad and a counter measure, but so far no solution has been found to avoid black pad in ackages with ENIG [3].Because of this, the industry is searching for alternative materials for BGA pads. Bare Cu or C