[理学]SMT设备原理与应用-第一章概述.ppt

使用预配置好的焊膏（solder paste）进行焊接，焊膏本身可以作为粘接剂 焊膏用模版印刷到PCB上 采用贴片机进行元件放置 在回流炉（reflow oven）中多个温区进行整体加热焊接 reflow soldering solder paste serves not only as a solder material, but also as a glue. the deposition of solder paste is usually conducted by the stencil or screen printing, dispensing, or pin-transferring processes. The premetered deposition of solder material onto the sites to be soldered ensures a consistent solder volume for the joints, and accordingly eliminates the insuf?cient solder volume problems due to the shadowing effect encountered by wave soldering. In addition, this premetered solder deposition also reduces the incidence of bridging. Advantages of solder paste technology in SMT the use of mass re?ow process allows a well-controlled graduate heating pro?le, thus eliminating potential damage of the SMCs due to the thermal shock caused by the wave soldering the use of solder paste allows the possibility of step soldering. the soldering performance of solder paste is not sensitive to the type of solder mask used on the PCBs. For the wave soldering process, a solder mask with a smooth ?nish is found to cause solder ball and bridging problems . Advantages of solder paste technology in SMT 技术发展趋势 Surface mount technology trends Technology driving force Smaller Faster Higher complexity Lower power Lower cost Speed processing speed increases approximately ?ve times in every 5 years; results from reduction in both on-chip delay in semiconductors and packaging delay this improvement in speed is closely associated with miniaturization of IC components, as demonstrated by the simultaneous reduction in line widths IC transistor integration The complexity of semiconductor chips can be measured by transistor integration. microprocessor integration has increased by 2000× since its introduction in 1970 This increase in complexity of semiconductor chips essentially drives the evolution of corresponding packaging and assembly technology Complexity Pin count number the pin