差分接口电平标准,设计硬件系统必备资料.pdfVIP

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差分接口电平标准,设计硬件系统必备资料.pdf

差分接口电平标准,设计硬件系统必备资料

AN1318 APPLICATION NOTE INTERFACING BETWEEN LVDS AND HIGH SPEED DIFFERENTIAL LOGIC FAMILIES G. Noviello 1. ABSTRACT This application note provides interfacing solutions between some of the popular standard differential logic families and LVDS technology. 2. INTRODUCTION. LVDS signals are differential signal technologies with a swing of 250 to 400mV and a DC offset of 1.2V. They are used today to interface between CMOS and BICMOS ASICs supplied with 3.3V or cell. LVDS, LVPECL, PECL and ECL are all differential technologies but with different swings and offsets (see figure 1). Figure 1: Voltage Levels PECL LVPECL LVDS ECL This application note will show the possible interface between the LVDS device and the other differential signal levels listed above. It will also give suggestions on how to interface supplied positive and negative devices. Due to its speed capability, the application board requires a proper technical high speed layout, otherwise the system performance will be reduced. As a general guideline to get better performance from the PCB, the transmission striplines should be adapted as specified: - The input line must be routed away from the output lines or separated from the larger swings; - the lines must be as short as possible; - the termination line resistors must be the nearest to the receiver; - the use of surface mount components are recommended. February 2001

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