添加La对共晶Sn.pdfVIP

添加添加La對共晶對共晶Sn-3.5Ag銲料微結構之銲料微結構之影響與細化機制研究影響與細化機制研究 添加添加 對共晶對共晶 銲料微結構銲料微結構之之影響與細化機制研究影響與細化機制研究 Influence of lanthanum additions on the microstructure and refined mechanism of the Sn-3.5Ag solder 1 1 2 1 2 1 2 李驊登 陳銀發 施谷達 林冠宇 陳銀發 李驊登 林冠宇 Y. F. Chen H. T. Lee K. Y. Lin H.T. Lee Y.F. Chen K.T. Shih K.Y. Lin 摘要 addition of La increased the microhardness of the 本研究之目的探討在 Sn-3.5Ag 共晶銲料中 Sn-Ag solder due to the refining effect of Ag3Sn 添加微量稀土元素的鑭(La, 0-1.0 wt.%) ，對其微 particles and increased formation of LaSn3 compounds. As aging time was increased, the 結構、界面層成長形為與銲料微硬度之影響。 microhardness of the solders decreased and the 同時利用環境式掃描電子顯微鏡(E-SEM)附加之 Ag Sn compounds coarsened. However, the 3 試件加熱載台加熱至 250°C 進行銲料加熱即時 coarsening of Ag Sn compounds was retarded by 3 觀察以研究其凝固行為。研究結果顯示 Sn- the La, and the size and amount of LaSn3 3.5Ag-xLa 銲料之微結構，主要是由 β-Sn 、 compounds did not change perceptibly with aging Ag Sn 與 LaSn 所構成，且LaSn 為該合金系統 time. Therefore, La additions can improve the 3 3 3 中的初始相可作為銲料凝固時的非均質成核位 microhardness and thermal resistance of solder 置，隨著 La 添加量的增加，基地中的 LaSn3 化