PowerPoint 簡報 - DBC (Direct Bonded Copper).pptVIP

What is the emphasis of solder void free in CPV? CPV systems use lenses or mirrors to focus a large area of sunlight into a small beam. The high temperature causes the small beam of sunlight and will damage the component of the solar cell, especially when solder with void. If solder void5%, better thermal conductivity can be achieved to improve efficiency. Combinations of TechnologyThick film resistors Plated DPC conductor pads Fine pad pitch, high pad adhesion, solder leash resistance and RoHS required. Chip Wire Bonding Good bondability due to flat and good uniformity on gold plated pad surface. Ceramic Carrier Fine pitch for C4 flip chip assembly, Good adhesion and solderability are required. Staking Substrate Assembly Memory Module Excellent electrical performance for high speed memory. RF Microwave Niche Applications Various clock oscillators require ultra high stability of frequency output. High REL Military ModuleHermetic package Good conductivity and pattern definition = Super electrical performance. Good bondability for reliable chip and wire bond performance. High REL Military Fine trace definition robust conductor pads, Excellent pad adhesion solder leach resistance. High Power RF Microwave DBC Process Void Free Solder Reflow  Two key processes for Concentrated Photovoltaic Solar Cell Now available at Tong Hsing Presented by: Chris Chang Date: May 11th, 2009 Concentrating photovoltaic Concentrating Photovoltaic (CPV) Systems employ sunlight concentrated onto photovoltaic surfaces for the purpose of electrical power production. Solar concentrators of all varieties may be used, and these are often mounted on a solar tracker in order to keep the focal point upon the cell as the sun moves across the sky. Efficiency of CPV Semiconductor properties allow solar cells to operate more efficiently in concentrated light, as long as the cell junction temperature is kept cool by suitable heat sinks. CPV