Dielectrophoresis (DEP)：介电泳（DEP）.ppt

Recommendations Exposure to light – removal of photoresist. Micro-fabrication Recommendations Dry plasma etching – removal of Silicon Oxide Micro-fabrication Recommendations Removal of photoresist with acetone Micro-fabrication Recommendations Ion implantation of electrode channels Micro-fabrication Recommendations Removal of silicon oxide via plasma etching with CF4 Micro-fabrication Recommendations Lap polish of wafer to 50μm thickness Micro-fabrication Recommendations Growth of SiO2 layers, removal from underside. Micro-fabrication Recommendations Spin deposition of photoresist and mask placement Micro-fabrication Recommendations Exposure to light - removal of photoresist Micro-fabrication Recommendations Dry plasma etching – removal of Silicon Oxide Micro-fabrication Recommendations Removal of photoresist with acetone Micro-fabrication Recommendations 110 wafer KOH through-etching of silicon wafer Micro-fabrication Recommendations Removal of silicon oxide via plasma etching with CF4 Micro-fabrication Recommendations Combination of base electrode layer and reservoir layer Micro-fabrication Recommendations Mated with wafer bonding over long electrodes, leaving wire-connection ports exposed Micro-fabrication Recommendations Mass production on a silicon wafer Glass cover with etched microchannel pattern and common reservoir Micro-fabrication Michael Beltran Robert Lam Bryan Lochman 12/14/07 Three-Dimensional Dielectrophoresis Device with Integrated Actuating and Impedance Sensing Three-Dimensional Dielectrophoresis Device with Integrated Actuating and Impedance Sensing Michael Beltran Robert Lam Bryan Lochman 12/14/07 Lab on a chip Lab on a chip technology will reduce the size of complex experimental setups. Eliminate large, bulky equipment. Move lab experiments to a non-lab environment. Especially useful in biological and medical fields for local use. Overview Device Overview Theory Dielectrophoresis (DEP) DEP cage actuation Impedance sensing Device Fabrication P