官方说明书FAIRCHILD Assembly Guidelines for Fairchilds TinyBuck Packaging 数据手册.pdf

/file/2689032 From ManualL ManualL collects and classifies the global product instrunction manuals to help users access anytime and anywhere, helping users make better use of products. Home: / Chinese: / This Manual: /file/2689032 Application Note AN-9049 Assembly Guidelines for Fairchild’s TinyBuck™ Packaging By Dennis Lang INTRODUCTION BOARD MOUNTING The Fairchild TinyBuck™ package is based on Molded The solder joint and pad design are the most important Leadless Packaging (MLP) technology. This technology factors in creating a reliable assembly. The pad must be has been increasingly used in packaging for power related designed to the proper dimensions to allow for tolerances products due to its low package height, excellent thermal in PWB fabrication and pick and place, and also to allow performance with large thermal pads in the center of the for proper solder fillet formation where applicable. MLP package which solder directly to the printed wiring board packages, when the pre-plated NiPdAu, lead-frame is sawn, (PWB) and allow modularity in package design, single and show bare copper on the end of the exposed side leads. multi-die packages are within the capability of MLP This is normal, and is addressed by IPC JEDEC J-STD- technology.