E103陶瓷電容教程.pptVIP

陶瓷電容器 1.MLCC 結構 2.陶瓷材料分類 3. MLCC製造流程 4.電容的標稱容值及允許偏差 5.電容的的性能 6.MLCC破裂之失效模式 7.墓碑效應 外部電極 Terminations 陶瓷基材 Ceramic Material 內部電極 Electrodes 陶瓷基板Ceramic Green Sheet 印刷電極Printed Electrode 端電極Electrode End 1.MLCC 結構 Multi-layer ceramic capacitor Structure MLCC材料及構造 MLCC material and construction Pd/PdAg鈀/鈀銀 PdAg鈀銀 Ceramic陶瓷 Plating Termination Pd/PdAg/Ni 鈀/鈀銀/鎳 Ag/Cu 銀/金 Sn錫 Ni鎳 Ceramic 陶瓷 Conventional MLCC PdAg Termination 晶粒 Grain 晶界 Grain Boundary ? BaTiO3 ,CaTiO3, SrTiO3 , NbTiO3 , TiO2 , La2O3 ... Electrode 電介質材料 Dielectric material 2.陶瓷材料分類 The classification of ceramic material Type I (Class I) : Temperature Compensation I類陶瓷:溫度補償型電容器 Liner function of cap. with temp. 容值與溫度呈線性關係 ex. NP0, N750 Type II (Class II) : High Dielectric Constant II類陶瓷:高介電常數類電容器 Non-liner function of cap. with temp. 容值與溫度呈非線性關係 ex. X7R, X5R, Y5V, Z5U EIA: Class I Ex. : C0G = NP0, T.C.= 0 ? -1 ? 30 ppm C : 0 N : Negative 0 : -1 P : Positive G : ?30 ppm 0 : ?0 溫度系數符號 Symbols of temperature coefficients 電容溫度系數代碼 Significant figure of temp. coeff. of c ap. ( ppm/ ℃ ) 符號 Symbol 代碼乘數 Multiplier applied to significant figure 符號 Symbol 溫度系數公差 Tolerance of temp. coeff. ( ppm) 符號 Symbol 0 0.3 0.8 0.9 1.0 1.5 2.2 3.3 4.7 5.6 7.5 C B L A M P R S T V U -1 -10 -100 -1000 -10000 1 10 100 1000 10000 0 1 2 3 4 5 6 7 8 9 ± 30 G H J K L M N ± 60 ± 120 ± 250 ± 600 ± 1000 ± 2500 Class I MLCC的溫度系數 Temperature coefficient of class I MLCC EIA: Class II, III Ex. : X7R Y5V Z5U X : -55?C Y : -30 ?C Z: +10 ?C 7 : +125 ?C 5 : +85 ?C 5 : +85 ?C R : ?15% V : +22 to -82% U: +22 to -56% 低溫 Low temp. ( ℃ ) 符號 Symbol 高溫 High temp. ( ℃) 符號 Symbol Max. Cap. change over temp. range (%) 符號 Symbol +10 -30 -55 Z Y X +45 +65 +85 +105 +125 +150 +200 2 4 5 6 7 8 9 ± 1.0 ± 1.5 ± 2.2 ± 3.3 ± 4.7 ± 7.5 ± 10 ± 15 ± 22 +22 to -33 +22 to -56 +22 to -82 A B C D E F P R S T U V 溫度系數符號 Symbols of temperature characteristics Class I MLCC的溫度系數/特性 Temperature coefficient/characteristic of MLCC Y5V Z5U X7R NP0 P